Ltcc Ceramic Package

Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions such as micro electronic mechanical systems mems and high frequency applications because such packages are hermetic and.

Ltcc ceramic package.

Schott is also able to supply low temperature cofired ceramic ltcc housings through its partnership with via electronic. Ceramic packages for automotive electronics. Components for fiber optic connectors. They offer excellent resistance to the shock of drop testing and are well suited as module substrate materials in mobile communication devices.

2 3 low cost multilayer ceramic package for flip chip mmic up to w band. High reliability ceramic substrates ltcc htcc. A low cost multilayer low temperature co fired ceramic ltcc package based on a mass production design rule for an mmic up to w band has been developed. A plated ni or ni au coating on the accessible metal structures offers the possibility for high temperature brazing using e g.

Ceramic packages for mems sensors. High strength materials ltcc hard. Ceramic packages for power electronics. The multilayer ceramic is co fired at high temperatures to form a solid and hermetic ceramic.

Htcc components generally consist of multilayers of alumina or zirconia with platinum tungsten and molymanganese metalization. Surface mount ceramic packages for electronic devices. Optical packages htcc is a practical choice or optical applications packages due to hermeticity flatness capability and stable over a wide temperature range. Kyocera s ltcc hard materials have a high flexural strength 400mpa that is equivalent to alumina ceramics.

Ausn eutectic process steps. Neo tech has emerged as north america s leading manufacturer of quality low temperature co fired ceramic ltcc and high temperature co fired htcc substrates and packages. Package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density hermetic packaging solutions available. Ltcc low temperature co fire ceramics is a multi layer glass ceramic substrate which is co fired with low resistance metal conductors at low firing temperature less than 1000.

These fabrication technologies provide unique solutions for high interconnect density compact networks and high. Ltcc substrate with embedded passive components. Our custom made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance. Ceramic packages and optical filters for image sensors.

High lead count packages. It is sometimes referred to as glass ceramics because its composition consists of glass and aluminum. The package structure includes a cavity for the flip chip mmic and improved coplanar feed through to suppress radiation. For htcc a final metal coating e g.